Metrology and Dimensional Analysis

The laboratory uses sophisticated measuring equipment

The GESTLABS laboratory has a dedicated dimensional measurement area, in a temperature- and humidity-controlled environment, and uses sophisticated measuring equipment.

The service consists of a report certifying the product’s compliance with its construction drawing; measurements are performed with high-resolution optical scanning machines and benchtop instruments.

Computerized measuring machine for linear measurements along the X, Y and Z axes

Non-contact measurements

OGP SmartScope FLASH 400 optical measuring machine. Non-contact dimensional measurements with a high-resolution (0.003 mm) 3D coordinate measuring machine with camera (OGP SmartScope). BGA ball coplanarity, ball height
BGA Balls coplanarity, balls height

Field of use: 450x450x200 mm

Margin of error:
XY =+/- (3.0 + 8L/1000) micron
Z =+/- (4.0 + 8L/1000) micron

Measurement of BOW&TWIST on PCB

Non-contact measurements

BOW: deviation from flatness of a board characterized by an approximately spherical or cylindrical curvature such that, if the product is rectangular, its four corners lie on the same plane.

TWIST: deformation of a panel or rectangular board occurring on its surface parallel to one of the diagonals, such that one of the corners does not lie on the same plane as the other three.

Test method: IPC TM 650 2.4.22C (bow and twist percentage of individual rigid printed boards, rigid portions of rigid-flex printed boards, and/or multiple printed panels) multiple printed panels)

XRF (X-ray fluorescence) for the measurement of finishing thicknesses

XRF spectrometry is a non-destructive analysis technique that makes it possible to evaluate the thickness of board finishes by analyzing the X-ray radiation they emit (the so-called characteristic X-ray fluorescence) following atomic excitation at a suitable energy.

Available instruments

GESTLABS labs

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