The GESTLABS laboratory has a dedicated dimensional measurement area, in a temperature- and humidity-controlled environment, and uses sophisticated measuring equipment.
The service consists of a report certifying the product’s compliance with its construction drawing; measurements are performed with high-resolution optical scanning machines and benchtop instruments.
OGP SmartScope FLASH 400 optical measuring machine. Non-contact dimensional measurements with a high-resolution (0.003 mm) 3D coordinate measuring machine with camera (OGP SmartScope). BGA ball coplanarity, ball height
BGA Balls coplanarity, balls height
Margin of error:
XY =+/- (3.0 + 8L/1000) micron
Z =+/- (4.0 + 8L/1000) micron
BOW: deviation from flatness of a board characterized by an approximately spherical or cylindrical curvature such that, if the product is rectangular, its four corners lie on the same plane.
TWIST: deformation of a panel or rectangular board occurring on its surface parallel to one of the diagonals, such that one of the corners does not lie on the same plane as the other three.
Test method: IPC TM 650 2.4.22C (bow and twist percentage of individual rigid printed boards, rigid portions of rigid-flex printed boards, and/or multiple printed panels) multiple printed panels)
XRF spectrometry is a non-destructive analysis technique that makes it possible to evaluate the thickness of board finishes by analyzing the X-ray radiation they emit (the so-called characteristic X-ray fluorescence) following atomic excitation at a suitable energy.
Failure analysis is a critical process aimed at determining how and why a product or component fails to work correctly.
Metallography identifies the chemical, physical, mechanical and technological characteristics of metallic materials in order to assess service conditions.
The chemical laboratory’s activities focus on the qualitative and quantitative analysis of chemical substances to verify their compliance.
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