Failure analysis process

The GESTLABS laboratory offers failure analysis services on printed boards, components and finished products. In particular, it uses X-ray analysis, C-SAM and metallographic microsections for the constructional analysis of components such as MLCCs, resistors and active components; datasheet-based electrical testing for the characterization of passive components such as resistors, capacitors, inductors and wiring, and of discrete active components such as diodes, MOSFETs, IGBTs and transistors. It can also perform decapsulation for the surface analysis of dies and wire bonding.

For the failure analysis of PCBs and PCBAs, the GESTLABS laboratory can carry out dimensional checks on conductors and surface insulation of printed boards, verify metallizations and stack-up through metallographic microsections and/or perform SEM-EDX electron microscopy analysis. It can also verify compliance with IPC standards through X-ray and optical analysis.

Among the analytical techniques used in the failure analysis process, the GESTLABS laboratory can rely on FT-IR (Fourier Transform InfraRed Spectroscopy) analysis for the detection of organic compounds, electrical checks (voltage, continuity) and Dye & Pry (BGA solder joint analysis), in addition to SEM-EDX electron microscopy analysis.

When analyzing product defects, we can define the failure analysis path, analyze the stress conditions imposed on components by the design, and measure and perform electrical characterization at steady state and during transients. We can also perform failure analysis of active and passive components, carry out infrared thermal mapping with measurements on components in a thermal chamber, simulate failures and define possible solutions.