The metallographic analysis is needed to understand the chemical, physical, mechanical, and technological features of metal materials, to evaluate the working conditions influence on the behavior of the materials, to check the reaction of a material to the specific requests, and to identify possible anomalies and the relative causes.
The metallography is a science which observes the inner structure of a material by studying the crystal morphology. The details obtained by the metallographic analysis allow to check the condition of the material.
Metallographic microsections
Cross-section metallographic analysis is a destructive investigation that verifies the correct construction of the printed board by checking the copper thickness in the inner layers and on the surface, the correct application of the solder mask, the metallization of the holes and the quality of the board drilling. The sample is sectioned and embedded in a dedicated resin; after further mechanical processing and, finally, lapping of the surface to be analyzed, it is observed under an optical microscope.
Test method: IPC TM 650 2.1.1 (Micro sectioning, Manual method)
Optical microscopy is the fundamental investigation method for the structural analysis of materials; this technique is particularly effective for studying heat-treatment anomalies, evaluating inclusions, interpreting fractures and assessing solder joints and coatings. Technical standards: IPC A-600 (Acceptability of Printed Boards), IPC A-610 (Acceptability of Electronic Assemblies), IPC 6012 (Qualification and Performance Specification for Rigid Printed Boards)
The Scanning Electron Microscope, commonly referred to as SEM, is a type of microscope that allows morphological investigation at high magnification. EDX Spectroscopy (Energy Dispersive X-ray Analysis) is an instrumental analytical method based on the interaction between a focused primary electron beam striking the sample and the electrons of the atoms making up the sample itself. The combined use of the two techniques makes it possible to correlate morphological (SEM) and compositional (EDX) characterization, providing a tool for understanding the composition and structure of materials.
The solderability test on printed boards is performed according to the IPC J-STD-003 standard, which describes the procedures and methods for determining the acceptability criteria for the wettability of board surface finishes. Through this method it is possible to evaluate the solderability of:
– surface conductors;
– attachment points;
– plated-through holes (PTHs) of printed boards.
The solderability test on components is performed according to the IPC J-STD-002 standard, which establishes test methods, defines defects and sets acceptability criteria for evaluating the solderability of terminals and flexible cables.
This test verifies that the solderability of component leads complies with the requirements of the standard. Test method: IPC J-STD-002 (Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires), IPC J-STD-003 (Solderability Test for Printed Boards)
This test is performed on PTHs (Plated-Through Holes) to determine whether they can withstand the thermodynamic effects of the extreme heat to which they may be exposed during assembly, rework or repair. Test method: IPC TM-650 2.6.8 (Thermal Stress, Plated-Through Holes)
The Dye & Pry technique is a destructive test used when a problem cannot be solved by optical inspection (for example, when defects are too small).
It is based on a liquid dye that penetrates the micro-cracks in solder joints. Once the dye has dried, the electronic components (BGAs, capacitors, resistors, etc.) are removed from the PCB and the solder joints are inspected; the presence of the dye reveals problem areas in the connections of all the interfaces involved.
Test method: Internal Method
X-ray analysis of electronic boards is a non-destructive technique for identifying and evaluating failures and/or defects such as opens, voids, solder balls and cracks in solder joints. This test also verifies correct component soldering and detects any solder voids. X-ray analysis reveals factors that might go unnoticed in a simple visual inspection. The evaluation can be performed both as oriented 2D views and as 3D volumetric views. Technical standards: IPC A-610 (Acceptability of Electronic Assemblies), IPC 7095 (Design and Assembly Process Implementation for BGAs).
Failure analysis is a critical process aimed at determining how and why a product or component fails to work correctly.
The laboratory has a dedicated dimensional measurement area, in a temperature- and humidity-controlled environment, equipped with advanced measuring instruments.
The chemical laboratory’s activities focus on the qualitative and quantitative analysis of chemical substances to verify their compliance.
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