ENVIRONMENTAL AND RELIABILITY TEST
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ENVIRONMENTAL AND RELIABILITY TEST
Among the main tests we can perform in our laboratories to evaluate and validate new processes and technologies, there are:
HTS (High Temperature Storage)
The aim of this ageing test is to characterise the quality of Intermetallic growth. It’s a long-duration and high-temperature test. 1000 hours and 125°C.
Technical regulations: IEC60068 (Environmental Tests Procedures)
S.I.R. (Surface InsulationResistance)
This test method is used to quantify the damaging effects of manufacturing, movement processes or residues on SIR in case of humidity. The electrodes (electronically polarised during the conditioning to ease electro-chemical reactions) are placed on parallel traces on a printed circuit or on a standard assembled sheet. The samples are conditioned, and the measures are taken at a high level of humidity.
Test Method: IPC TM-650 2.6.3.7 (Surface Insulation Resistance)
ATC (Accelerated Thermal Cycling)
The aim of this test is to evaluate the stress to which the soldering is subjected, according to the temperature variation. The ATC involves a slow temperature variation, not more than 20°C per minute. The thermal cycle provokes a different thermal expansion / contraction according to the material composition, by creating mechanical stresses which include plastic deformations on the material. This provokes a stress able to speed up the life cycle of the material. For example, the thermal cycle can cause micro-fractures inside the soldering, and, after several cycles, it can cause a total breakout.
Technical regulations: IEC60068 (Environmental Tests Procedures)
T&H Temperature and Humidity
The aim of this test is to evaluate the impact of chemical substances on PCBA (for example fluxes residues). This test is performed according to the JEDEC JESD22-100C Standards and by respecting the following test parameters: a duration of 240 hours, with a temperature at 85°C and 85% of humidity. The result of the functional test is considered as positive if there is no dendritic growth.
Technical regulations: IEC60068 (Environmental Tests Procedures)
Thermal Shock
The thermal shocks are different from thermal cycles because of the quick temperature change. For this reason, they provoke also different failure mechanisms. During the thermal shocks, the materials are subjected to deformation phenomena. On the PCBA they cause the PCB or assembled components deformation by creating a deformation perpendicular to the sheet surface.
Technical regulations: IEC60068 (Environmental Tests Procedures)
AVAILABLE EQUIPMENT
ANGELANTONI mod. CTS 157/2T
Type: Double chamber
Test:
Thermal Cycle Chamber,
Thermal Shock Test
QUANTITY: 2
FEATURES: -60°C / +200°C
STANDARD PROFILES: -55°C / +125°C
Ramp rate: Transizione immediata
NECESSARY SIZES (LXHXP):
530x450x660 mm
VOTSCH mod. VC7012 S2
TYPE: Double chamber
Test:
Thermal Cycle Chamber,
Thermal Shock Test
QUANTITY: 1
FEATURES: -80°C / +200°C
STANDARD PROFILES: -55°C / +125°C
Ramp rate: Transizione immediata
NECESSARY SIZES (LXHXP):
470x650x410 mm
ANGELANTONI CLIMATIC SYSTEM mod. TY150C/SP
TYPE: Single chamber
Test:
Thermal Cycle Chamber,
Temperature Cycling Test
QUANTITY: 1
FEATURES: -30°C / +150°C
STANDARD PROFILES: 0°C / +100°C
Ramp rate: 10°C / min
NECESSARY SIZES (LXHXP):
580x320x450 mm
WEISS mod. WT1-480/70/15
TYPE: Single chamber
Test:
Thermal Cycle Chamber,
Temperature Cycling Test
QUANTITY: 1
FEATURES: -70°C / +180°C
STANDARD PROFILES:
-40°C / +100°C
-55°C / +125°C
Ramp rate: 12°C / min
NECESSARY SIZES (LXHXP):
800x1000x600 mm
SECASI mod. VRT50 C200 F50/3
TYPE: Single chamber
Test:
Thermal Cycle Chamber,
Temperature Cycling Test
QUANTITY: 2
FEATURES: -30°C / +200°C
STANDARD PROFILES:
0°C / +100°C
0°C / +125°C
Ramp rate: max 8°C / min
NECESSARY SIZES (LXHXP):
340x340x435 mm
SECASI mod. VRT50 C200 F70/5
TYPE: Single chamber
Test:
Thermal Cycle Chamber,
Temperature Cycling Test
QUANTITY: 1
FEATURES: -70°C / +200°C
STANDARD PROFILES:
-40°C / +65°C
-10°C / +150°C
Ramp rate: 10°C / min
NECESSARY SIZES (LXHXP):
340x340x435 mm
MAZZALI mod. Tesys 630H
TYPE: Single chamber
Test:
Thermal Cycle Chamber,
Temperature Cycling Test
QUANTITY: 1
FEATURES: -70°C / +180°C
STANDARD PROFILES:
-40°C / +100°C
-55°C / +125°C
Ramp rate: 7°C / min
NECESSARY SIZES (LXHXP):
700x1000x700 mm
VOTSCH mod. VC4057
TYPE: Climatic Chamber
Test:
Temperature,
Humidity,
Bias SOAK
QUANTITY: 3
FEATURES:
-40°C / +150°C
10/98% RH
STANDARD PROFILES:
+85°C / 85% RH,
+30°C / 60% RH
NECESSARY SIZES (LXHXP):
575x645x550 mm
VOTSCH mod. VC7018
TYPE: Climatic Chamber
Test:
Temperature,
Humidity,
Bias SOAK
QUANTITY: 1
FEATURES:
-75°C / +180°C,
10/98% RH
STANDARD PROFILES:
+85°C / 85% RH,
+30°C / 60% RH
NECESSARY SIZES (LXHXP):
580x750x450 mm
ANGELANTONI CLIMATIC SYSTEM mod. HYGROS 600
TYPE: Climatic Chamber
Test:
Temperature,
Humidity,
Bias SOAK
QUANTITY: 2
FEATURES:
-40°C / +180°C,
10/98% RH
STANDARD PROFILES:
+85°C / 85% RH,
+30°C / 60% RH
DNECESSARY SIZES (LXHXP):
820x700x700 mm
A.C.S. mod. CHALLANGE 250-TC
TYPE: Single chamber
Test:
Thermal Cycle Chamber,
Temperature Cycling Test
QUANTITY: 2
FEATURES: -55°C / +180°C
STANDARD PROFILES:
-40°C / +100°C
-55°C / +125°C
Ramp rate: 3°C / min
NECESSARY SIZES (LXHXP):
520x700x520 mm
MAZZALI mod. Thermair 700
TYPE: Thermal Oven
Test:
Cure & Bake
QUANTITY: 1
FEATURES: +150°C
STANDARD PROFILES: +40°C / +250°C
NECESSARY SIZES (LXHXP):
430x430x480 mm
BIOBLOCK
TYPE: Thermal Oven
Test: Cure & Bake
QUANTITY: 1
FEATURES: +125°C
STANDARD PROFILES: +40°C / +200°C
NECESSARY SIZES(LXHXP):
430x450x460 mm
